depends on the type of solder but yeah, I’m not exactly holding it there tho. just high airflow at that temp for a few seconds to push the rosin underneath the chips. helps a lot with bga chips where water can actually get underneath the chip and short connections or leave debris even once evaporated. for actually reworking chips I use around 480c.
I mean, solder melts at temperatures lower than 300 degrees Celsius.
depends on the type of solder but yeah, I’m not exactly holding it there tho. just high airflow at that temp for a few seconds to push the rosin underneath the chips. helps a lot with bga chips where water can actually get underneath the chip and short connections or leave debris even once evaporated. for actually reworking chips I use around 480c.